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Duval Research Inc. provides start
to finish analysis and design for cooling your electronic equipment.
Finite Element Analysis (FEA) is used extensively to simulate air flow in your system and then an off
the shelf heatsink solution will be determined to fit your cost, quality
and manufacturing requirements. Conduction-Cooled military and
severe environment VME and other high powered computer cards are
another area in which we provide solutions. We have designed and
performed, simulated and tested boards and their enclosures that are used
in submarines (depth charge survivability), locomotives (high vibration,
temp. and oily), helicopters (high resonant vibration), and
others. |
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Thermal analysis and
cooling |
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Thermal modeling is most effective when
started early on to be integrated into the rest of the system rather
than adapting to a failed design. |
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(305) 767-3720 Key West, FL Fax: (413) 581-3269 Email: questions @
duvalresearch.com
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| Electronic
Packaging | Shock / Vibration solutions
& analysis | Thermal analysis and
cooling | Facilities |
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Mechanical Solutions for Severe environment
Electronic and Optical products |
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RTP, NC & Key West, FL |
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Airflow through a rack mounted computer
showing "dead" zones" |
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Full 6KW computer system forced air FEA model. These simulations provide basis for processor and other high-powered components |
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Air-cooled computer board's custom
heatsink. A Copper spreader plate is mounted between custom extruded
aluminum heatsink and multiple
processors. |